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MESSAGE _ENGLISH VERSION_
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Title: First sale of the ODRA system to an industrial client serving the semiconductor sector in the defense and AI industries in the U.S. Legal basis: Article 17_1_ MAR - inside information. Content of the Report: The Management Board of XTPL S.A. _the "Issuer", the "Company", "XTPL"_ announces that on March 9, 2026, the Company accepted an order for the delivery of the ODRA system _"ODRA"_ from an industrial customer headquartered in Silicon Valley, U.S. _the "Client"_, which constitutes the conclusion of a sales agreement. The value of the agreement ranges from USD 400,000 to USD 500,000. Revenue generated from the delivery of the ordered device will have a positive impact on the financial results of XTPL S.A. for the fourth quarter of 2026. The order will be processed by XTPL Inc., headquartered in Boston, U.S. The transaction supports the implementation of the 2026-2028 Strategy, which targets PLN 100 million in revenues by 2028 [Current Report No. 27/2025 dated September 25, 2025]. The ODRA device _previously referred to under the working name DPS+_ constitutes XTPL's fourth business line, filling the gap between the DPS _Delta Printing System_ laboratory devices and industrial UPD modules. The standalone system is designed for High-Mix, Low-Volume _HMLV_ industrial manufacturing, i.e., diversified production in small batches. Key features of ODRA 1. Potential for repeat orders: professional users typically require more than one ODRA system, which differentiates this product line from DPS _typically one device per client_. 2. User profile: industrial clients, including defense sector contractors - in contrast to DPS, which is primarily used by laboratories, research institutes, and R_D centers. 3. Unit price: USD 400,000-500,000 more than twice the price of DPS. Client profile The first purchaser of ODRA is an industrial client headquartered in Silicon Valley, California, U.S., specializing in advanced semiconductor packaging and providing prototyping and High-Mix, Low-Volume _HMLV_ production services for demanding clients in the technology and defense sectors. The Client holds ITAR _International Traffic in Arms Regulations_ certification, enabling collaboration with defense-sector contractors. The Client is also a member of a prestigious international R_D consortium for advanced semiconductor packaging in Silicon Valley. The Client previously purchased a Delta Printing System _DPS_ _Current Report No. 48/2024 dated October 14, 2024_ and has been using it for over a year to conduct preliminary evaluation of XTPL technology. The current purchase of the ODRA system represents an important validation of XTPL's technology. The Client is transitioning from a prototyping device to a more advanced, production-oriented tool in order to expand its service offerings. There is potential for the purchase of additional ODRA units following successful installation and validation of the first system. Market context Advanced semiconductor packaging is one of the fastest-growing segments of the global electronics industry, driven by the development of artificial intelligence _AI_, 5G networks, autonomous driving, and the Internet of Things _IoT_. XTPL's technology, enabling ultra-precise deposition of conductive structures, addresses key needs within this sector. The profile of the first prospective ODRA user, its client portfolio, and its ITAR certification provide significant potential for XTPL technology in projects for the defense sector. The Company has previously signaled interest from defense-sector entities in UPD technology, which led to the sale of a DPS system to a U.S. industrial customer from the defense sector _Current Report No. 12/2025 dated March 28, 2025_. Another DPS device was sold to the University of Massachusetts, Lowell _Current Report No. 13/2025 dated April 8, 2025_, which operates the Raytheon-UMass Lowell Research Institute _RURI_ laboratory. Potential applications include electromagnetic shielding for drones, high-frequency communications for radar systems, and repair of advanced microelectronic components in near-field battlefield environments. Accordingly, for the reasons described above, in the Management Board's opinion the information disclosed in this current report meets the criteria of inside information within the meaning of Article 7_1_ MAR.
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